AMD today announced the AMD Versal Premium Gen 2 Memory on Package (MoP) adaptive system-on-chips (SoCs). The MoP architecture integrates up to 32GB of LPDDR5X into a single package, delivering up to 288GB/s of bandwidth in up to 60% less board area, letting engineers build high-bandwidth systems without the risk and time of board-level memory design. As physical AI, networking, and aerospace and defense workloads push more data through ever-tighter space and power budgets, MoP targets the designs that need it most: test and measurement, professional video editing, and VPX systems for secure communications and defense acceleration.
“For years, system architects had to choose between the memory bandwidth they wanted and the space, power and longevity their programs could actually live with. Memory on Package removes that tradeoff. Our customers can design for the system they want to build, not the one their memory constraints allow, and bring it to market faster.” Sumit Shah, head of product management and marketing, Adaptive and Embedded Computing Group, AMD.
Shrink the Footprint and Scale the Bandwidth
With our new memory on package adaptive SoC, we are redefining what is possible in compact system designs. By integrating LPDDR5X directly into the package, the device enables higher performance compared to onboard LPDDR5X while using less area than discrete implementations.
This opens the door to form factors that have been difficult or impractical with external memory, such as the Enterprise and Datacenter Standard Form Factor (EDSFF) and 3U VPX systems, while also helping designers meet telecom and VPX requirements that discrete memory approaches often cannot match.
Versal Premium Gen 2 MoP devices integrate CXL 3.1 and PCIe 6.0 at 64Gb/s in hard IP, enabling high-speed data movement when paired with AMD EPYC CPUs to accelerate data-intensive applications. We help system architects gain greater flexibility to scale memory resources with LPDDR5X support of up to 9,000Mb/s and connectivity to CXL memory pooling and expansion modules.
Built for Long Life Cycle Deployments
Designed with demanding physical and enterprise AI environments in mind, Versal Premium Gen 2 MoP adaptive SoCs support industrial-grade operation from -40 degrees Celsius to 110 C. They are well suited for always-on, mission-critical systems where performance and resilience must go hand in hand.
With LPDDR5X and 15-plus-year life cycle support, Versal Premium Gen 2 MoP devices help decouple product availability from high-bandwidth memory’s (HBM) shorter, data-center-driven refresh cycles, reducing the risk of forced redesigns caused by memory end of life or limited accessibility.
PCIe Integrity and Data Encryption (IDE), a feature introduced in PCIe 6.0, helps protect against physical attacks by securing data in flight at the link layer. DDR memory encryption in integrated controllers helps protect data at rest without consuming programmable logic resources. Hard 400G High-Speed Crypto Engines enable high-bandwidth secure processing, strengthening security without sacrificing throughput.
Accelerate Time-to-Market
Versal Premium Gen 2 MoP devices include a pre-validated, in-package LPDDR5X interface that eliminates high-speed memory routing across the circuit board to reduce board-level simulation and validation while helping shorten development cycles, lower design risk and minimize costly re-spins.
Users can begin development today with standard AMD Versal Premium Series Gen 2 devices, which are now shipping. Support for established AMD Vivado and Vitis tool workflows, compatible IP and available reference designs helps quickly move designs from concept to deployment while enabling existing customers to adopt new MoP devices with no rework or relearning.
AMD Versal Premium Gen 2 MoP devices begin sampling at the end of 2026 with production shipments expected to begin in the second half of next year.
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